3.1 Introduction

OSI Sensor Model Packaging (OSMP) is a package layer specification for the Open Simulation Interface (OSI). It specifies how models that use OSI are packaged as Functional Mock-up Units (FMUs) in accordance with the Functional Mock-up Interface 2.0 (FMI 2.0).

This is version 1.3.0 of this specification. The version number is to be interpreted according to the Semantic Versioning Specification 2.0.0.